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Please use this identifier to cite or link to this item: http://eprint.iitd.ac.in/handle/2074/2154

Title: Effect of structure on thermal behaviour of epoxy resins
Authors: Jain, Preeti
Choudhary, V
Varma, I K
Keywords: Phosphorus containing epoxy resin
Amide–acid amines
Imide linkage
Curing behaviour
Thermal stability
Char yield
Issue Date: 2002
Citation: European Polymer Journal, 39(1), 181 - 187p.
Abstract: The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide–acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TAP) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4′-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (B). Amide–acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4′-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide–acid amines were used as curing agents for DGEBA.
URI: http://eprint.iitd.ac.in/dspace/handle/2074/2154
Appears in Collections:Centre for Polymer Science and Engineering [CPSE]

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