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Please use this identifier to cite or link to this item: http://eprint.iitd.ac.in/handle/2074/628

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dc.contributor.authorTuli, Suneet-
dc.contributor.authorBhattacharyya, Amalendu B-
dc.contributor.authorForget, Benoit C-
dc.contributor.authorFournier, Daniele-
dc.date.accessioned2005-07-30T09:52:34Z-
dc.date.available2005-07-30T09:52:34Z-
dc.date.issued1998-
dc.identifier.citationSensors and actuators A, 64(3), 203-207en
dc.identifier.urihttp://eprint.iitd.ac.in/dspace/handle/2074/628-
dc.description.abstractA contact,non-destructive techique for the depth profiling of micromachined structures is presented.Based on the mirage or optical beam deflection method of photothermal spectrosocpy, an expremental measurement of a 8p.m step in silicon is given by way of illustration.en
dc.format.extent175345 bytes-
dc.format.mimetypeapplication/pdf-
dc.language.isoenen
dc.subjectDepth profilingen
dc.subjectMicromachiningen
dc.subjectMirage effecten
dc.subjectSiliconen
dc.titleMirage-effect-based depth profiling of micromachined silicon structuresen
dc.typeArticleen
Appears in Collections:Applied Research in Electronics [CARE]

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