Author: | Chaudhry, Anurag; M Jagadesh Kumar |
Advisor: | Advisor |
Date: | 2004
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Publisher: | |
Citation: | Device and
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Series/Report no.: |
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Item Type: | Article
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Keywords: | MOS device; silicon-on-insulator (SOI); short-channel effects; ULSI applications; dual-material gate; drain-induced barrier lowering; ultra-small geometry |
Abstract: | This paper examines the performance degradation of a MOS device fabricated on silicon-on-insulator (SOI) due to the undesirable short-channel effects (SCE) as the channel length is scaled to meet the increasing demand for high-speed high-performing ULSI applications. The review assesses recent proposals to circumvent the SCE in SOI MOSFETs and a short evaluation of strengths and weaknesses specific to each attempt is presented. A new device structure called the dual-material gate (DMG) SOI MOSFET is discussed and its efficacy in suppressing SCEs such as drain-induced barrier lowering (DIBL), channel length modulation and hot-carrier effects, all of which affect the reliability of ultra-small geometry MOSFETs, is assessed. |